SLC : 1Gb-8Gb 3.0V [ML-3] Product Datasheets Part Number Page Size Product Status Density Access Time Packaging Datasheet S34ML08G3 4KB For New Designs, Production 8 Gb 25 ns 48-pin TSOP, 63 Ball BGA Unfold S34ML08G3 2KB For New Designs, Production 8 Gb 25 ns 48-pin TSOP, 63 Ball BGA Unfold S34ML04G3 4KB For New Designs, Production 4 Gb 25 ns 48-pin TSOP, 63 Ball BGA Unfold S34ML04G3 2KB For New Designs, Production 4 Gb 25 ns 48-pin TSOP, 63 Ball BGA Unfold S34ML02G3 2KB For New Designs, Production 2 Gb 25 ns 48-pin TSOP, 63 Ball BGA Unfold S34ML01G3 2KB Sampling Soon 1 Gb 25 ns 48-pin TSOP, 63 Ball BGA Unfold
Temperature Range : Industrial (-40°C to +85°C), Industrial Plus (-40°C to +105°C), Automotive AEC-Q100 Grade 3 (-40°C to +85°C), Automotive AEC-Q100 Grade 2 (-40°C to +105°C)
SLC : 1Gb-16Gb 1.8V [MS-2] Product Datasheets Part Number Product Status Density Access Time Packaging Datasheet S34MS08G2 For New Designs, Production 8 Gb 45 ns 63-Ball BGA Unfold S34MS04G2 For New Designs, Production 4 Gb 45 ns 48-pin TSOP, 63-Ball BGA Unfold S34MS02G2 For New Designs, Production 2 Gb 45 ns 48-pin TSOP, 63-Ball BGA Unfold S34MS01G2 For New Designs, Production 1 Gb 45 ns 48-pin TSOP, 63-Ball BGA, 67-ball Unfold
SLC : 1Gb-16Gb 3.0V [ML-2] Product Datasheets Part Number Product Status Density Access Time Packaging Datasheet S34ML16G2 For New Designs, Production 16 Gb 25 ns 48-pin TSOP, 63-ball BGA Unfold S34ML08G2 For New Designs, Production 8 Gb 25 ns 48-pin TSOP, 63-ball BGA Unfold S34ML04G2 For New Designs, Production 4 Gb 25 ns 48-pin TSOP, 63-ball BGA Unfold S34ML02G2 For New Designs, Production 2 Gb 25 ns 48-pin TSOP, 63-ball BGA Unfold S34ML01G2 For New Designs, Production 1 Gb 25 ns 48-pin TSOP, 63-Ball BGA, 67-ball Unfold
SLC : 2Gb - 4Gb 1.8V [MS-1] Product Datasheets
Part Number
Product Status Density Access Time Packaging Datasheet S34MS04G1 Production 4 Gb 45 ns 48-pin TSOP, 63-Ball BGA Unfold S34MS02G1 Production 2 Gb 45 ns 48-pin TSOP, 63-Ball BGA Unfold
SLC : 2Gb - 8Gb 3.3V [ML-1] Product Datasheets Part Number Product Status Density Access Time Packaging Datasheet S34ML08G1 Production 8 Gb 25 ns 48-pin TSOP, 63-ball BGA Unfold S34ML04G1 Production 4 Gb 25 ns 48-pin TSOP, 63-ball BGA Unfold S34ML02G1 Production 2 Gb 25 ns 48-pin TSOP, 63-ball BGA Unfold
SLC : 1Gb-4Gb 3.0V [SL] Product Datasheets Part Number Product Status Density Access Time Packaging Datasheet S34SL04G2 For New Designs, Production 4 Gb 25 ns 63-ball BGA Unfold S34SL02G2 For New Designs, Production 2 Gb 25 ns 63-ball BGA Unfold S34SL01G2 For New Designs, Production 1 Gb 25 ns 63-Ball BGA Unfold
SPI NAND : 1Gb-4Gb 3.0V [ML-3] Product Datasheets Part Number Page Size Product Status Density Package Description Package Dimension Datasheet S35ML04G3 2KB For New Designs, Production 4 Gb 8-pin LGA 6 x 8 mm Unfold S35ML02G3 2KB For New Designs, Production 2 Gb 8-pin LGA 6 x 8 mm Unfold S35ML01G3 2KB For New Designs, Production 1 Gb 8-pin LGA 6 x 8 mm Unfold
e.MMC Product Datasheets Part Number Product Status Density Package Description Package Dimension Datasheet S40FC004 Production 4 GB FBGA 153 11.5 x 13 x 0.8 mm Unfold S40FC004 Production 4 GB FBGA 153 9.0 mm x 7.5 mm x 0.8 mm Unfold S40FC002 Production 2 GB FBGA 153 11.5 x 13 x 0.8 mm Unfold S40FC002 Production 2 GB FBGA 153 9.0 mm x 7.5 mm x 0.8 mm Unfold S40FC008 Production 8 GB FBGA 153 11.5 x 13 x 0.8 mm S40FC0016 Coming Soon 16 GB
